Manual Bonder with semi auto. process capabilities. Tresky's T-5300 is the flagship of our Die Bonders and adds a motorized, programmable Z-axis, with our True ...
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The company Dr. Tresky has been supplying innovative bonder and assembly equipment since 1980 primarily to industrial sectors such as micro and ...
We are pleased to introduce our Die Bonder and Pick and Place systems, which are designed for research and development purposes as well as for small batch ...
Tresky Die Bonders can be equiped or upgraded with several options. According to your specific needs you can configure your perfect piece of equipment.
Like all Tresky Die Bonder this pick & place system operates with True Vertical Technology™. The increased travel range, now 95mm on Z, allows working on ...
Die Bonding systems from Dr. Tresky are the first choice wherever the highest demands are placed on positioning accuracy, the fastest implementation of a ...
Tresky's T-5300 is the flagship of our Die Bonders and adds a motorized, programmable Z-axis, with our True Vertical Technology™, to the repertoire of the ...
Tresky's DIE bonders for research and development as well as series production stand for the best bonding results. Made in Germany.
Semiautomatic die bonder equipment for die attach of components onto microelectronic devices using solder, epoxy, film, eutectic processes etc.
Tresky AG has developed a wide range of static and dynamic heaters and a powerful software package. All Tresky Die Bonder can be equipped with the following ...